The Defence Research and Development Organisation (DRDO) has showcased a range of indigenous semiconductor technologies intended for advanced radar systems, electronic warfare equipment and tactical missiles at the Emerging Science, Technology and Innovation Conclave (ESTIC) 2026 in New Delhi.
The event was held at Bharat Mandapam from 27 to 29 October 2026. The Ministry of Defence said the display demonstrated India’s expanding ability to develop critical defence electronics domestically. The technologies were presented as part of DRDO’s wider contribution to the conclave, which brought together industry, academia and participants from the indigenous chip-development ecosystem.
Components developed for military applications
DRDO’s Solid State Physics Laboratory (SSPL), Delhi, developed the semiconductor technologies displayed at the event. They included Monolithic Microwave Integrated Circuits (MMICs) based on Gallium Arsenide (GaAs) and Gallium Nitride (GaN), as well as Multi-Chip Modules (MCMs).
According to the Ministry of Defence, these components form building blocks for advanced radar and electronic warfare applications and have been used in several strategic missions. Their inclusion in the showcase underlines the role of specialised semiconductor devices in military systems that require domestically developed electronics.
| Technology | Application highlighted by DRDO |
|---|---|
| GaAs and GaN MMICs | Advanced radar and electronic warfare |
| Multi-Chip Modules | Radar and electronic warfare systems |
| Infrared Focal Plane Arrays | Sensing elements for tactical missiles |
DRDO also displayed Infrared Focal Plane Arrays (IRFPAs), which serve as sensing elements in tactical missiles. When integrated with imaging infrared seekers, the technology enables missiles to detect and track targets during the terminal phase of an engagement. The exhibits included short-wave, mid-wave and long-wave infrared technologies.
Focus on next-generation chip design
Alongside the technology display, DRDO led a dedicated session on “Semiconductors & Next-Generation Chips”. The session brought together representatives from industry, academic institutions and India’s chip-development sector. Discussions covered AI system-on-chips, advanced microprocessors and ways to accelerate domestic chip design.
The organisation said its work is also focused on enabling industries and start-ups to develop specialised solutions and strengthen core technologies needed for next-generation chip development. The session placed particular attention on purpose-built AI system-on-chips and intelligence at the silicon edge, areas presented as part of the changing microprocessor landscape.
- SSPL, Delhi, developed the GaAs, GaN and multi-chip semiconductor technologies displayed at ESTIC 2026.
- DRDO presented infrared sensing technologies covering short-wave, mid-wave and long-wave applications.
- The organisation linked domestic chip design with radar, electronic warfare and tactical missile requirements.
The showcase comes as DRDO expands its engagement with Indian industry, academic institutions and start-ups in critical technology areas. The Ministry of Defence’s presentation at ESTIC 2026 connected semiconductor development with the domestic supply of key defence electronics, while the organisation’s technical session focused on translating research into specialised systems for military applications.
